Yongpan LIU, Ph.D. Lecturer
Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
Tel: +86-10-62796637
Fax: +86-10-62770317
E-mail: ypliu@tsinghua.edu.cn
Education background
Ph.D., Electronic Engineering, Jan. 2007
Tsinghua University, Beijing, China
Master of Science, Electronic Engineering, July 2002
Tsinghua University, Beijing, China
Bachelor of Engineering, Electrical Engineering, June 1999
Tsinghua University, Beijing, China
Experience
07/2007-present Lecture and Assistant Professor, Dept. of Electronic Engineering, Tsinghua Univ.
06/2002-07/2004 Research Fellow,Dept. of Electrical and Electronic Engineering, Tsinghua Univ
Concurrent Academic
Graduate
Mixed Signal Circuit and System Design (2009-present; )
Embedded Computing System and SoC HW/SW Co-Design (2009-present; )
Social service
CONFERENCE
ICCCAS 2009 TPC
ICGCS2010 TPC
ACADEMIC ORGANIZATION
Member, IEEE, IEICE
Reviewer of IEEE Trans. VLSI ASICON05, ICIC06, APCCAS06, ICCCAS06, GLSVLSI07, CF07
Areas of Research Interests/ Research Projects
Ultra Low Power VLSI for ZigBee and 802.11 Protocols
Power Efficient LSI for Software-defined Radio
Embedded System Design
Electronic Design Automation
Research Status
1. National Science and Technology Major Project, “SoC Chips for Medium and High Speed Wireless Sensor Network”, January 2010- December 2012, Co-Principle Investigator.
The project is to develop a fully-integrated SoC for medium and high speed wireless sensor network. The key problems resolved were power efficiency, communication baseband and disruption tolerance.
2. Ministration of Education and Intel Cooperation Joint Foundation, “ATOM-based Vehicle Wireless Computing Platform and SoC”, April 2010 – April 2012, Principle Investigator.
The project is to develop an ATOM-based Vehicle Computing Platform for 802.11P protocol. The key problems to be resolved are SoC architecture design and protocol acceleration implementation.
3. National Science Foundation of China, “Non-volatile Logic Research for Wireless Sensor Network”, December 2009 – December 2012, Principle Investigator.
The project is to explore the LSI design based on Non-volatile Logic and Memory. The key problems to be resolved are design issues encountered in the new technologies, such as power management, novel circuit architecture and corresponding network protocols.
4. High-Tech Research and Development (863) Program, “Low Power Heterogeneous Multi-Core SoC Design and Computing Based on Sensor Network on Chip”, January 2009 – December 2010, Principle Investigator.
The project is to develop a design flow for multi-core SoC and corresponding online management mechanisms. The key problems to be resolved are multi-core SoC architecture, sensors placement and online scheduling strategies.
5. Cross Discipline Foundation of Tsinghua National Laboratory of Information Science and Technology, “Wireless Sensor Network Based Real-time Tunnel Monitoring” July 2009 – July 2011, Principle Investigator.
The project is to develop a wireless sensor network to monitor the vibration and displacement of bridge and tunnel architecture. The key problems to be resolved are specific sensor development and network protocols.
Honors And Awards
Co-Leader of Tsinghua Team for NUEDC Contest, First Class, 2004
Tsinghua Nortel Scholarship, First Class, 2005
Tsinghua Cadence Scholarship, Second Class, 2006
Key Member in Tsinghua 985 Research Support Plan, 2008
Excellent Member of CPC in Electronic Engineering Dept., 2009
Nominated by Fok Ying Tung Foundation, 2009
Academic Achievement
[1] B.H. Ying, Y.P. Liu, H. Z. Yang, H. Wang, “Evaluation of Tunable Data Compression in Energy-Aware Wireless Sensor Networks”, Sensors, 2010, 10, 3195-3217 (SCI IF 1.870)
[2] Tian Z X, Liu Y P, Yang H Z. “Combined novel gate level model and critical primary input sharing for genetic algorithm based maximum power supply noise estimation.” Chinese Journal of Semiconductors, 2007, 28(9): 1375-1380
[3] Shaohua Wang, Guangming Yu, Yongpan Liu , Huazhong Yang, “Low noise fully digitally controlled LC oscillator with back-to-back in series MOS varactors”, Journal of Tsinghua University (Science and Technology), 48(7) 2008.
[4] Yongpan Liu, Huazhong Yang, Rong Luo, Hui Wang, “Thermal-Aware Floorplanning Considering Empty Space Effect Based on Genetic Algorithms”, Chinese Journal of Electronics, vol.16 no.3 429-434, July, 2007
[5] Yongpan Liu, Yinan Sun, Yihao Zhu, Huazhong Yang, "Design Methodology of Variable Latency Adders with Multistage Function Speculation", To appear in ISQED2010, San Jose, 2010
[6] Hengyu Long, Yongpan Liu, Yiqun Wang, Robert P. Dick, Huazhong Yang, "Battery Allocation for Wireless Sensor Network Lifetime Maximization Under Cost Constraints", p.705-712, ICCAD 2009
[7] Jue Wang, Beihua Ying, Yongpan Liu, Huazhong Yang, Hui Wang, “Energy Efficient Architecture of Sensor Network Node Based on Compression Accelerator”, p.117--120, Boston, GLSVLSI, 2009.
[8] Hengyu Long, Yongpan Liu, Robert P. Dick, Huazhong Yang, “Energy-Efficient Spatially-Adaptive Clustering and Routing in Wireless Wireless Sensor Networks”, p.1267-1272, Nice, DATE, 2009.
[9] Yongpan Liu, Robert Dick, Li Shang, Huazhong Yang, “Accurate Temperature-Dependent Integrated Circuit Leakage Power Estimation is Easy”, p.1526-1532 , DATE 2007, Nice, France. (Cited 19 times)
[10] Yongpan Liu, Huazhong Yang, Robert Dick, Hui Wang, Li Shang, “Thermal vs Energy Optimization for DVFS-enabled Processors in Embedded Systems”, p. 204- 209 , ISQED 2007, San Jose, USA. (Cited 22 times)
BOOKS
1. Rong Luo, Yu Wang, Yongpan Liu, “Digital Principles and Design”, Tsinghua Press, Oct. 2006
2. Rong Luo, Wei Liu, Hong Luo, Yongpan Liu, “Contemporary Logic Design”, Publishing House of Electronics Industry, Mar. 2006