During the 10th International Conference on Information Optics and Photonics (CIOP 2018), the Optoelectronic Chip Industry Summit Forum initiated by Professor Huang Yidong from Tsinghua University was successfully held on July 8.
Xu Xinchao, Director of the New Energy and New Materials Division of Beijing Municipal Science & Technology Commission, Cai Yongxiang, Deputy Director of Beijing New Materials and New Energy Technology Development Center, and Xia Jin, Optoelectronic Competent Engineer of Beijing New Materials and New Energy Technology Development Center, et al. attended the forum. The forum was presided over by Professor Huang Yidong from Tsinghua University.
The forum invited domestic high-tech companies in the optoelectronic chip industry chain such as epitaxy, process, packaging and application, aiming to integrate resources and gather strength through information exchange and idea collision to jointly promote the development of the optoelectronic chip industry in China.
Dr. Luo Shuai from Jiangsu Huaxing Laser Technology Co., Ltd. made a report on "localization of compound semiconductor laser epitaxy" from industry background, application and market such as global market pattern of optoelectronic devices and systems, the localization rate of optical transceiver modules and chips in 2017, and the optoelectronic industry chain.
Dr. Qu Di, CEO of H-Chip Technology (Tianjin) Co., Ltd., pointed out the current status in the report "localization of high-end optoelectronic laser chips" that the output of China's optical communication lasers cannot meet the market demand of optical communication systems, and the structure of the semiconductor laser industry in China is unreasonable, hoping to build an incubation service platform for innovation and entrepreneurship in the optoelectronic field through the high-end optoelectronic chip innovation center and the supporting industrial parks of the Institute for Electronics and Information Technology in Tianjin, Tsinghua University, and build an industrial ecosystem in the optoelectronic field.
In the "recent progress of VCSE" report, Dr. Ryan from Changzhou Vertilite Semiconductor Technology Co., Ltd. said that the vertical-cavity surface-emitting laser (VCSEL) is a booming emerging field. However, at present, only a few teams in China have the core technology, the products are immature, and the supply chain cannot meet the market demand yet. Through the promotion of the core chip industry, the optoelectronic module market can be further opened.
Dr. Ding Hai from Suzhou Inno Light Technology Corporation made a report titled "laser for the next generation of cloud computing and wireless optical networks", introducing cloud computing, wireless networks and technical trends of this type of laser, and introducing the product distribution of this type of laser.
In the "challenges and opportunities of 3D sensing" report, Dr. Zhu Li from Shenzhen Deptrum Technology Co., Ltd. introduced 3D sensing mobile phone market, 3D technical routes, structured light technology solutions in the industry, and HCM applications, and so on.
Dr. Li Yunxiang from Beijing Zvision Technologies Co., Ltd. made a report titled "'chip' opportunity of laser radar". He introduced the distribution of laser radar manufacturers and the market conditions and the technical bottlenecks currently, and pointed out that solid state is the general trend of the development of laser radar in the future.
Dr. Wang Yin from Ningbo Healthy Photon Technology Co., Ltd. said in the report "quantum cascade lasers and their applications" that internationally, the commercialized quantum cascade lasers are completely manufactured by foreign companies, and there is still a big gap between the domestic research results of this kind of chips and the foreign advanced level, and the industrialization is still in its initial stage.
Yang Yi from Shanghai Blue Lake Lighting Technology Co., Ltd. made a report titled "key technologies, current status and future of laser lighting", introducing the advantages of laser lighting, analyzing the application fields and market of laser lighting, and comparing the two technical solutions of RGB laser light combining and laser + fluorescence conversion.
This forum is the beginning of optoelectronic chip industry summit forum which will be held every year thereafter. At the same time, the forum will initiate the "Optoelectronic Chip Industry Alliance" to promote the innovation and entrepreneurship of companies in the optoelectronic technology field, serve the industrialization of the high-end optoelectronic products in China, and set up a special fund for optoelectronic chips to practically implement the optoelectronic chip industry.
